发明授权
US07863347B2 Resin composition, varnish, resin film and semiconductor device using the same
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树脂组合物,清漆,树脂膜和使用其的半导体器件
- 专利标题: Resin composition, varnish, resin film and semiconductor device using the same
- 专利标题(中): 树脂组合物,清漆,树脂膜和使用其的半导体器件
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申请号: US12294592申请日: 2007-03-16
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公开(公告)号: US07863347B2公开(公告)日: 2011-01-04
- 发明人: Kazuyoshi Fujita , Atsushi Izumi , Yumiko Yamanoi , Takahiro Harada , Hiromi Oki , Yukiharu Ono
- 申请人: Kazuyoshi Fujita , Atsushi Izumi , Yumiko Yamanoi , Takahiro Harada , Hiromi Oki , Yukiharu Ono
- 申请人地址: JP Tokyo
- 专利权人: Sumitomo Bakelite Company, Ltd.
- 当前专利权人: Sumitomo Bakelite Company, Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Ditthavong Mori & Steiner, P.C.
- 优先权: JP2006-091336 20060329
- 国际申请: PCT/JP2007/055431 WO 20070316
- 国际公布: WO2007/111168 WO 20071004
- 主分类号: C08G63/44
- IPC分类号: C08G63/44 ; C08G63/52 ; C08G65/50 ; C08G69/26 ; C08G73/10 ; C08G73/22 ; C08L101/02
摘要:
A resin composition is provided comprising a compound having a structure represented by formula (1) and a crosslinking agent: wherein in formula (1), R0 is a single bond or has a structure represented by formula (2); R1 to R8 are respectively any of hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms other than the group having an alicyclic structure, a hydroxyl group and a carboxyl group; and “X” is any of —O—, —NHCO—, —CONH—, —COO— and —OCO—; further, wherein in formula (2), “Ar” is an aromatic group; “Y” is any of a single bond, —O—, —S—, —OCO— and —COO—; “q” is an integer of 1 or more; R9 is hydrogen or an organic group having 1 or more carbon atoms and may be identical with or different from each other when “q” is an integer of 2 or more; at least one of R1 to R8 is the group having an alicyclic structure when R0 is a single bond; at least one of R1 to R9 is the group having an alicyclic structure when R0 has the structure represented by formula (2); and “*” and “**” represent a position to be bonded to a different chemical structure.
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