发明授权
US07863703B2 Systems and methods for biasing high fill-factor sensor arrays and the like
有权
用于偏置高填充因子传感器阵列等的系统和方法
- 专利标题: Systems and methods for biasing high fill-factor sensor arrays and the like
- 专利标题(中): 用于偏置高填充因子传感器阵列等的系统和方法
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申请号: US12379581申请日: 2009-02-25
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公开(公告)号: US07863703B2公开(公告)日: 2011-01-04
- 发明人: JengPing Lu , James B. Boyce
- 申请人: JengPing Lu , James B. Boyce , Kathleen Dore Boyce, legal representative
- 申请人地址: US CT Norwalk
- 专利权人: Xerox Corporation
- 当前专利权人: Xerox Corporation
- 当前专利权人地址: US CT Norwalk
- 代理机构: Oliff & Berridge, PLC
- 主分类号: H01L29/868
- IPC分类号: H01L29/868 ; H01L31/105
摘要:
A high fill-factor photosensor array is formed comprising a P-layer, an I-layer, one or more semiconductor structures adjacent to the I-layer and each coupled to a N-layer, an electrically conductive electrode formed on top of the P-layer, and an additional semiconductor structure, adjacent to the N-layer and which is electrically connected to a voltage bias source. The bias voltage applied to the additional semiconductor structure charges the additional semiconductor structure, thereby creating a tunneling effect between the N-layer and the P-layer, wherein electrons leave the N-layer and reach the P-layer and the electrically conductive layer. The electrons then migrate and distribute uniformly throughout the electrically conductive layer, which ensures a uniform bias voltage across to the entire photosensor array. The biasing scheme in this invention allows to achieve mass production of photosensors without the use of wire bonding.