发明授权
- 专利标题： Conductive ball removing method, conductive ball mounting method, conductive ball removing apparatus, and conductive ball mounting apparatus
- 专利标题（中）： 导电球去除方法，导电球安装方法，导电球去除装置和导电球安装装置
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申请号： US12336875申请日： 2008-12-17
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公开(公告)号： US07866533B2公开(公告)日： 2011-01-11
- 发明人: Kazuo Tanaka , Kiyoaki Iida , Hideaki Sakaguchi , Nobuyuki Machida
- 申请人： Kazuo Tanaka , Kiyoaki Iida , Hideaki Sakaguchi , Nobuyuki Machida
- 申请人地址： JP Nagano-shi
- 专利权人： Shinko Electric Industries Co., Ltd.
- 当前专利权人： Shinko Electric Industries Co., Ltd.
- 当前专利权人地址： JP Nagano-shi
- 代理机构： Rankin, Hill & Clark LLP
- 优先权： JP2007-327099 20071219; JP2008-095296 20080401
- 主分类号： B23K1/20
- IPC分类号： B23K1/20 ; B23K3/06
摘要：
In a method of removing conductive balls that are left on a mask provided on a substrate having pads thereon, the method includes: (a) making a sheet member close to the mask using a contacting mechanism such that a gap between the sheet member and the mask is set small than a diameter of the conductive balls. The conductive balls are removed in such a manner that the conductive balls are adhered onto the sheet member.
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