Invention Grant
- Patent Title: Pre-treatment process for liberation of metals from waste printed circuit boards using organic solution
- Patent Title (中): 使用有机溶液从废印刷电路板中释放金属的预处理过程
-
Application No.: US12310324Application Date: 2008-07-28
-
Publication No.: US07867317B2Publication Date: 2011-01-11
- Inventor: Jae Chun Lee , Jae Min Yoo , Jin Ki Jeong , Manis Kumar Jha
- Applicant: Jae Chun Lee , Jae Min Yoo , Jin Ki Jeong , Manis Kumar Jha
- Applicant Address: KR Daejeon
- Assignee: Korea Institute of Geoscience and Minderal Resources
- Current Assignee: Korea Institute of Geoscience and Minderal Resources
- Current Assignee Address: KR Daejeon
- Agency: Clark & Brody
- Priority: KR10-2007-0116992 20071116
- International Application: PCT/KR2008/004391 WO 20080728
- International Announcement: WO2009/064063 WO 20090522
- Main IPC: C22B3/22
- IPC: C22B3/22 ; B01D43/00
Abstract:
A method for recovering valuable metals contained in printed circuit boards of waste electronic machine, and more particularly, a method for liberating metal and plastic laminated in waste printed circuit boards uses an organic solvent and then separates and recovers the liberated metal components using an electrostatic separation process.
Public/Granted literature
Information query
