Abstract:
A method for recovering valuable metals contained in printed circuit boards of waste electronic machine, and more particularly, a method for liberating metal and plastic laminated in waste printed circuit boards uses an organic solvent and then separates and recovers the liberated metal components using an electrostatic separation process.
Abstract:
The present invention relates to a method for recovering valuable metals contained in printed circuit boards of waste electronic machine, and more particularly, to a method for recovering valuable metals from waste printed circuit boards by separating several plastic layers laminated using an organic solution and then separating plastic components from metal components using an electrostatic separation process.According to the present invention, it is possible to separate the non-metal containing the plastic components and the metal components from the waste printed circuit boards by separating the several plastic layers laminated via simple pre-process using an organic solvent and obtain the metal recovery ratio of 99.99% via the pre-process and an electrostatic separation process.