NOVEL PRE-TREATMENT PROCESS FOR LIBERATION OF METALS FROM WASTE PRINTED CIRCUIT BOARDS USING ORGANIC SOLUTION
    2.
    发明申请
    NOVEL PRE-TREATMENT PROCESS FOR LIBERATION OF METALS FROM WASTE PRINTED CIRCUIT BOARDS USING ORGANIC SOLUTION 有权
    使用有机溶液从废弃印刷电路板中分离金属的新型预处理工艺

    公开(公告)号:US20100071507A1

    公开(公告)日:2010-03-25

    申请号:US12310324

    申请日:2008-07-28

    Abstract: The present invention relates to a method for recovering valuable metals contained in printed circuit boards of waste electronic machine, and more particularly, to a method for recovering valuable metals from waste printed circuit boards by separating several plastic layers laminated using an organic solution and then separating plastic components from metal components using an electrostatic separation process.According to the present invention, it is possible to separate the non-metal containing the plastic components and the metal components from the waste printed circuit boards by separating the several plastic layers laminated via simple pre-process using an organic solvent and obtain the metal recovery ratio of 99.99% via the pre-process and an electrostatic separation process.

    Abstract translation: 本发明涉及一种用于回收废电子机的印刷电路板中所含的有价金属的方法,更具体地说,涉及一种通过分离使用有机溶液层压的多个塑料层然后分离的废旧印刷电路板中的有价金属来回收的方法 使用静电分离工艺的金属部件的塑料部件。 根据本发明,可以通过使用有机溶剂通过简单的预处理分离多个层压的塑料层,从而将废塑料组分和金属组分的非金属与废印刷电路板分离,并获得金属回收 通过预处理和静电分离过程的比例为99.99%。

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