发明授权
- 专利标题： Structure and method for enhancing resistance to fracture of bonding pads
- 专利标题（中）： 提高接合焊盘断裂性的结构和方法
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申请号： US12174074申请日： 2008-07-16
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公开(公告)号： US07867887B2公开(公告)日： 2011-01-11
- 发明人: Ian D. Melville , Mukta G. Farooq , Dae Young Jung
- 申请人： Ian D. Melville , Mukta G. Farooq , Dae Young Jung
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Scully, Scott, Murphy & Presser, P.C.
- 代理商 Wenjile Li
- 主分类号： H01L21/768
- IPC分类号： H01L21/768
摘要：
The present invention provides bond pads structures between semiconductor integrated circuits and the chip package with enhanced resistance to fracture and improved reliability. Mismatch in the coefficient of temperature expansion (CTE) among the materials used in bond structures induces stress and shear on them that may result in fractures within the back end dielectric stacks and cause reliability problems of the packaging. By placing multiple metal pads which are connected to the bond pad through multiple metal via, the adhesion between the bond pads and the back end dielectric stacks is enhanced.
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