发明授权
- 专利标题： Integrated circuit package-on-package stacking system
- 专利标题（中）： 集成电路封装堆叠系统
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申请号： US12730171申请日： 2010-03-23
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公开(公告)号： US07868434B2公开(公告)日： 2011-01-11
- 发明人: Dioscoro A. Merilo , Heap Hoe Kuan , You Yang Ong , Seng Guan Chow , Ma. Shirley Asoy
- 申请人： Dioscoro A. Merilo , Heap Hoe Kuan , You Yang Ong , Seng Guan Chow , Ma. Shirley Asoy
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
An integrated circuit package-on-package stacking system includes a leadframe interposer including: a leadframe having a lead; a molded base on a portion of the lead for only supporting the lead; and the leadframe interposer singulated from the leadframe, wherein the lead is bent to support a stack-up height.
公开/授权文献
- US20100176497A1 INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM 公开/授权日：2010-07-15
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