Invention Grant
- Patent Title: Power supply apparatus and method
- Patent Title (中): 电源装置及方法
-
Application No.: US11148312Application Date: 2005-06-09
-
Publication No.: US07869227B2Publication Date: 2011-01-11
- Inventor: Seung-eon Lee , Kyoung-geun Lee , Jong-cheol Lee
- Applicant: Seung-eon Lee , Kyoung-geun Lee , Jong-cheol Lee
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR Suwon-si
- Agency: Stanzione & Kim, LLP
- Priority: KR10-2004-0067715 20040827
- Main IPC: H02M3/335
- IPC: H02M3/335

Abstract:
A method of supplying a power to elements in a power supply apparatus including a primary side and a second side. Particularly, a method of supplying a driving power to an element at the primary side of the power supply apparatus from a primary coil of a transformer. A power factor improvement section improves a power factor of a received alternating current (AC) power. A transformer then receives the AC power having the improved power factor from a primary coil and generates an induced power at a secondary coil. The transformer then provides the AC power to drive a predetermined element located at the primary side of the power supply apparatus from the primary coil.
Public/Granted literature
- US20060044303A1 Power supply apparatus and method Public/Granted day:2006-03-02
Information query
IPC分类: