发明授权
- 专利标题: Thermally conductive structure of LED and manufacturing method thereof
- 专利标题(中): LED的导热结构及其制造方法
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申请号: US12325554申请日: 2008-12-01
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公开(公告)号: US07875900B2公开(公告)日: 2011-01-25
- 发明人: George Anthony Meyer, IV , Chien-Hung Sun , Chieh-Ping Chen
- 申请人: George Anthony Meyer, IV , Chien-Hung Sun , Chieh-Ping Chen
- 申请人地址: TW Taoyuan
- 专利权人: Celsia Technologies Taiwan, Inc.
- 当前专利权人: Celsia Technologies Taiwan, Inc.
- 当前专利权人地址: TW Taoyuan
- 代理机构: HDLS IPR Services
- 代理商 Chun-Ming Shih
- 主分类号: H01L33/00
- IPC分类号: H01L33/00
摘要:
A thermally conductive structure of a light emitting diode (LED) includes a vapor chamber, an insulating layer, an electrically conductive layer and a plurality of LEDs. In the invention, the insulating layer is plated over a surface of the vapor chamber; the electrically conductive layer disposed on the insulating layer is electrically separated from the vapor chamber and has a first electrode and a second electrode; and the LEDs arranged on the insulating layer respectively have a first leg connected to the first electrode and a second leg connected to the second electrode; thereby, the invention has an excellent performance of thermal conduction and heat dissipation, which is capable of prolonging the lifespan of LED.
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