摘要:
In a memory device and its heat sink, the memory device includes a memory, a heat sink mounted onto the memory and a clamping element, and the heat sink includes an isothermal vapor chamber plate and a heat dissipating body, and the isothermal vapor chamber plate is attached onto an external side of the memory and includes an insert portion, and the heat dissipating body includes a base plate, a plurality of heat dissipating fins extended from the base plate, and a pawl arm extended from the base plate and in an opposite direction of the fins, and the heat dissipating body is coupled to the insert portion in a replaceable manner by the pawl arm, and the clamping element is provided for clamping the base plate and the isothermal vapor chamber plate, such that the heat dissipating body can be replaced on the isothermal vapor chamber plate easily.
摘要:
A buckling device for electronic heating element, inter-assembled with a thermally conductive body, includes a cooling plate, a pair of fixing legs bent-and-extended from the cooling plate and formed under the cooling plate and a fixing arm bent-and-extended from the cooling plate and formed under the cooling plate. On the cooling plate, a plurality of slots are stamped, one side of each of which is bent and configured into a cooling piece. The thermally conductive body is fixed by being sandwiched between the fixing arm and the cooling plate. Thereby, the buckling device can be used in a thin electronic device to reduce its assembly and machining costs on a large scale.
摘要:
The planar heat pipe includes a metallic tube composed of two flat extensions and a shrinked intermediate structure, a wick structure, a working fluid and a support element. The flat extensions are separately located at two ends of the metallic tube. The intermediate structure connects between the flat extensions. The wick structure is arranged in the metallic tube. The working fluid is injected in the metallic tube and attached in the wick structure. The support element is disposed in the metallic tube for supporting the wick structure.
摘要:
A thermally conductive structure of a light emitting diode (LED) includes a vapor chamber, an insulating layer, an electrically conductive layer and a plurality of LEDs. In the invention, the insulating layer is plated over a surface of the vapor chamber; the electrically conductive layer disposed on the insulating layer is electrically separated from the vapor chamber and has a first electrode and a second electrode; and the LEDs arranged on the insulating layer respectively have a first leg connected to the first electrode and a second leg connected to the second electrode; thereby, the invention has an excellent performance of thermal conduction and heat dissipation, which is capable of prolonging the lifespan of LED.
摘要:
A vapor chamber is provided to include shell, capillary tissue, working fluid, heat-absorbing section and heat-releasing section. A hollow chamber is formed in the shell. The capillary tissue is arranged and accommodated in the hollow chamber. The working fluid is injected into and filled in the hollow chamber. Two corresponding surfaces of the shell at the heat-releasing section are respectively a non-planar shape. Because the two corresponding surfaces of the shell at the heat-releasing section are respectively a non-planar shape, the structure strength of the vapor chamber is higher and the anti-deforming ability is superior, thereby the using life of the vapor chamber being prolonged. In addition, the vapor chamber can be combined with cooling fins to become a cooling device. Since the two corresponding surfaces of the shell at the heat-releasing section are respectively designed as a non-planar shape, the vapor chamber and the cooling fins have larger contacting surfaces, making the heat-transferring effectiveness thereby enhanced significantly.
摘要:
A panel heat-dissipating device includes a heat-conducting base, a vapor chamber, and at least one fin assembly. The heat-conducting base has a heat-conducting surface for allowing the vapor chamber to be thermally connected thereon. The vapor chamber forms extending portions toward the lateral of the heat-conducting base. The extending portion of the vapor chamber toward the lateral of the heat-conducting base allows the fin assembly to be disposed thereon. The fin assembly and the heat-conducting base are located to the same side of the vapor chamber. Via this arrangement, the heat-dissipating device occupies less space in the height.
摘要:
The present invention provides a flat-type heat pipe and a wick structure thereof. The flat-type heat pipe has a flat tube. The wick structure is arranged inside the flat tube along an axial line of the flat tube. The wick structure comprises a first wick portion and two second wick portions connected on both sides of the first wick portion. The thickness of the first wick portion is larger than that of the second wick portion. The first wick portion abuts against an upper inner wall of the flat tube. An air channel is formed between each of the second wick portions and the upper inner wall of the flat tube. The wick structure supports the inner wall of the flat-type heat pipe without providing additional supporting structure, so that the heat pipe can be made more compact.
摘要:
A serially-connected heat-dissipating fin assembly includes a plurality of heat-dissipating fins and a thermal-conducting element. Each of the heat-dissipating fins is provided with a hollow connecting portion for allowing the thermal-conducting element to be disposed through. The inner edge of the connecting portion of the respective heat-dissipating fins is provided with a protruding wall. The protruding wall is provided with a plurality of abutting portions slightly protruding toward the connecting portions. The surface of the thermal-conducting element is brought into frictional contact with the abutting portions to thereby tightly fit into the connecting portions of the respective heat-dissipating fins. With the interference fit between the respective abutting portions and the surface of the thermal-conducting element, it is unnecessary to use solders.
摘要:
A heat-dissipating device includes a heat-dissipating body, a vapor chamber and a fan assembly. The heat-dissipating body includes a thermal-conductive element and a radial fin assembly. The thermal-conductive element includes a solid post and extending arms extending therefrom. The radial fin assembly includes radially-arranged heat-dissipating fins that form a central hole to enclose the sold post, engaging troughs inserted by the extending arms, and an airflow space. An air channel is formed between any two heat-dissipating fins. The vapor chamber is provided at one end of the solid post, while the fan assembly is arranged on the other end and received in the airflow space to correspond to the respective air channels. Thus, the mobility of air and the heat-dissipating efficiency can be increased, thereby conforming to the requirements for compact design.
摘要:
A heat pipe includes a metal pipe, a flexible structure, a woven mesh, a working fluid, and a support element. The flexible structure is formed on the metal pipe, and the woven mesh is disposed inside the metal pipe, and the working fluid is filled into the metal pipe and attached onto the woven mesh, and the support element is passed into the woven mesh, such that the heat pipe can be bent into a desired shape manually by an easy way according to actual using requirements.