An LGA socket used for connecting a chip module and a print circuit board includes an insulative housing and a number of terminals received in the housing. The housing has a top surface and a bottom surface opposite to each other. Each of the terminals includes an upper arm extending beyond the top surface of the housing and a lower arm extending beyond the bottom surface of the housing. The upper arms and the lower arms of the terminals extend from the base portion with different lengths so as to form different pitches at top and bottom surfaces of the housing.