发明授权
- 专利标题: Structure and manufacturing method of semiconductor memory device
- 专利标题(中): 半导体存储器件的结构和制造方法
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申请号: US11274258申请日: 2005-11-16
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公开(公告)号: US07879626B2公开(公告)日: 2011-02-01
- 发明人: Tetsuya Ohnishi , Naoyuki Shinmura , Shinobu Yamazaki , Takahiro Shibuya , Takashi Nakano , Masayuki Tajiri , Shigeo Ohnishi
- 申请人: Tetsuya Ohnishi , Naoyuki Shinmura , Shinobu Yamazaki , Takahiro Shibuya , Takashi Nakano , Masayuki Tajiri , Shigeo Ohnishi
- 申请人地址: JP Osaka
- 专利权人: Sharp Kabushiki Kaisha
- 当前专利权人: Sharp Kabushiki Kaisha
- 当前专利权人地址: JP Osaka
- 代理机构: Nixon & Vanderhye P.C.
- 优先权: JP2004-333130 20041117
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
A semiconductor memory device having a cross point structure includes a plurality of upper electrodes arranged to extend in one direction, and a plurality of lower electrodes arranged to extend in another direction at a right angle to the one direction of the upper electrodes. Memory materials are provided between the upper electrodes and the lower electrodes for storage of data. The memory materials are made of a perovskite material and arranged at the lower electrodes side of the corresponding upper electrode extending along the corresponding upper electrode.
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