发明授权
US07879647B2 Semiconductor device and a method of manufacturing the same 有权
半导体装置及其制造方法

Semiconductor device and a method of manufacturing the same
摘要:
A technique for mounting two semiconductor chips over a wiring substrate including mounting a first chip having first bonding pads over a surface of the wiring substrate having electrodes and stacking the second chip having second bonding pads over the first chip; connecting each of the first bonding pads to an associated one of the electrodes of the wiring substrate via an associated first wire; and connecting each of the second bonding pads to an associated one of the electrodes of the wiring substrate via an associated second wire. The bondings being carried out using a reverse bonding method in which at least one of the first and second wires are first bonded to an associated one of the electrodes of the wiring substrate followed by the bonding thereof to an associated one of the bonding pads of the first or second semiconductor chip.
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