Invention Grant
- Patent Title: Method for cutting nonmetal material
- Patent Title (中): 切割非金属材料的方法
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Application No.: US11649534Application Date: 2007-01-04
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Publication No.: US07880118B2Publication Date: 2011-02-01
- Inventor: Yuan-Chieh Cheng , Kuo-Cheng Huang , Hui-Hsiung Lin , Wen-Hong Wu
- Applicant: Yuan-Chieh Cheng , Kuo-Cheng Huang , Hui-Hsiung Lin , Wen-Hong Wu
- Applicant Address: TW Hsinchu
- Assignee: Instrument Technology Research Center, National Applied Research Laboratories
- Current Assignee: Instrument Technology Research Center, National Applied Research Laboratories
- Current Assignee Address: TW Hsinchu
- Agency: Volpe and Koenig P.C.
- Priority: TW95132976A 20060906
- Main IPC: B23K26/00
- IPC: B23K26/00

Abstract:
A method for cutting a nonmetal material is provided. The method includes steps of (a) generating a tension stress on a surface of the nonmetal material by exerting a bending stress thereon; (b) providing a thermal effect along a path direction on the surface, wherein the thermal effect grows along a direction opposite to the path direction; (c) providing a first cryogenic effect in a first incident direction along the path direction; and (d) providing a second cryogenic effect in a second incident direction along the path direction, wherein a crack along the path direction on the surface is formed as a result of the tension stress, the thermal effect, and the cryogenic effects therealong for cutting the nonmetal material.
Public/Granted literature
- US20080074747A1 Method for cutting nonmetal material Public/Granted day:2008-03-27
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