Invention Grant
- Patent Title: Method for making chip resistor components
- Patent Title (中): 制造片式电阻器元件的方法
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Application No.: US12040234Application Date: 2008-02-29
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Publication No.: US07882621B2Publication Date: 2011-02-08
- Inventor: Mu-Yuan Chen , Wen-Feng Wu , Chi-Pin Chang , Kao-Po Chien
- Applicant: Mu-Yuan Chen , Wen-Feng Wu , Chi-Pin Chang , Kao-Po Chien
- Applicant Address: TW Hsin-Tien
- Assignee: Yageo Corporation
- Current Assignee: Yageo Corporation
- Current Assignee Address: TW Hsin-Tien
- Agency: Abelman, Frayne & Schwab
- Main IPC: H01C17/28
- IPC: H01C17/28

Abstract:
A method for making chip resistor components includes: (a) forming a plurality of first and second notches in a substrate so as to form resistor-forming strips; (b) forming pairs of upper and lower electrodes on each of the resistor-forming strips; (c) forming a resistor film on each of the resistor-forming strips; (d) forming an insulator layer on the resistor film; (e) forming a hole pattern in the insulator layer and the resistor film; (f) forming an insulating shield layer on the insulator layer; (g) cleaving the substrate along the first notches so as to form a plurality of strip-like semi-finished products; (h) forming a pair of side electrodes on two opposite sides of each of the semi-finished products; and (i) cleaving each of the semi-finished products.
Public/Granted literature
- US20090217511A1 METHOD FOR MAKING CHIP RESISTOR COMPONENTS Public/Granted day:2009-09-03
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