公开(公告)号：US07882621B2

公开(公告)日：2011-02-08

申请号：US12040234

申请日：2008-02-29

Applicant: Mu-Yuan Chen ,  Wen-Feng Wu ,  Chi-Pin Chang ,  Kao-Po Chien

Inventor： Mu-Yuan Chen ,  Wen-Feng Wu ,  Chi-Pin Chang ,  Kao-Po Chien

IPC: H01C17/28

CPC classification number: H01C17/06 ,  H01C17/006 ,  Y10T29/49082 ,  Y10T29/49099 ,  Y10T29/49101 ,  Y10T29/49124

Abstract: A method for making chip resistor components includes: (a) forming a plurality of first and second notches in a substrate so as to form resistor-forming strips; (b) forming pairs of upper and lower electrodes on each of the resistor-forming strips; (c) forming a resistor film on each of the resistor-forming strips; (d) forming an insulator layer on the resistor film; (e) forming a hole pattern in the insulator layer and the resistor film; (f) forming an insulating shield layer on the insulator layer; (g) cleaving the substrate along the first notches so as to form a plurality of strip-like semi-finished products; (h) forming a pair of side electrodes on two opposite sides of each of the semi-finished products; and (i) cleaving each of the semi-finished products.

Abstract translation: 一种制造芯片电阻器组件的方法包括：（a）在衬底中形成多个第一和第二凹口，以形成电阻器形成条; （b）在每个电阻器形成条上形成一对上电极和下电极; （c）在每个电阻器形成条上形成电阻膜; （d）在电阻膜上形成绝缘体层; （e）在绝缘体层和电阻膜中形成孔图案; （f）在绝缘体层上形成绝缘屏蔽层; （g）沿着所述第一凹口切割所述基板，以形成多个条状半成品; （h）在每个半成品的两个相对侧上形成一对侧电极; 和（i）切割每个半成品。

公开(公告)号：US20090217511A1

公开(公告)日：2009-09-03

申请号：US12040234

申请日：2008-02-29

Applicant: Mu-Yuan Chen ,  Wen-Feng Wu ,  Chi-Pin Chang ,  Kao-Po Chien

Inventor： Mu-Yuan Chen ,  Wen-Feng Wu ,  Chi-Pin Chang ,  Kao-Po Chien

IPC: H01C17/06

CPC classification number: H01C17/06 ,  H01C17/006 ,  Y10T29/49082 ,  Y10T29/49099 ,  Y10T29/49101 ,  Y10T29/49124

Abstract: A method for making chip resistor components includes: (a) forming a plurality of first and second notches in a substrate so as to form resistor-forming strips; (b) forming pairs of upper and lower electrodes on each of the resistor-forming strips; (c) forming a resistor film on each of the resistor-forming strips; (d) forming an insulator layer on the resistor film; (e) forming a hole pattern in the insulator layer and the resistor film; (f) forming an insulating shield layer on the insulator layer; (g) cleaving the substrate along the first notches so as to form a plurality of strip-like semi-finished products; (h) forming a pair of side electrodes on two opposite sides of each of the semi-finished products; and (i) cleaving each of the semi-finished products.

Abstract translation: 一种制造芯片电阻器组件的方法包括：（a）在衬底中形成多个第一和第二凹口，以形成电阻器形成条; （b）在每个电阻器形成条上形成一对上电极和下电极; （c）在每个电阻器形成条上形成电阻膜; （d）在电阻膜上形成绝缘体层; （e）在绝缘体层和电阻膜中形成孔图案; （f）在绝缘体层上形成绝缘屏蔽层; （g）沿着所述第一凹口切割所述基板，以形成多个条状半成品; （h）在每个半成品的两个相对侧上形成一对侧电极; 和（i）切割每个半成品。