An image device and a method of fabricating the image device include a substrate pattern formed to define an opening and to include a portion of a photodiode for receiving light. Stacked metal interconnection patterns and an interlayer dielectric layer are formed beneath the substrate pattern. A height of the opening equals a height of the substrate pattern, such that an exposed portion of a top surface of the interlayer dielectric layer provides a bottom surface of the opening. An external connection electrode is positioned on the bottom surface of the opening.