发明授权
- 专利标题： Process for producing multilayer printed wiring board
- 专利标题（中）： 多层印刷线路板的制造方法
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申请号： US12463708申请日： 2009-05-11
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公开(公告)号： US07886438B2公开(公告)日： 2011-02-15
- 发明人: Shoji Ito , Ryoichi Kishihara , Osamu Nakao , Hiroki Hashiba , Masahiro Okamoto
- 申请人： Shoji Ito , Ryoichi Kishihara , Osamu Nakao , Hiroki Hashiba , Masahiro Okamoto
- 申请人地址： JP Tokyo
- 专利权人： Fujikura Ltd.
- 当前专利权人： Fujikura Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2003-011635 20030120; JP2003-294994 20030819; JP2003-309254 20030901; JP2003-342907 20031001
- 主分类号： H01K3/10
- IPC分类号： H01K3/10
摘要：
At least one base material having a wiring circuit that has been formed into a predetermined outer shape is bonded to a motherboard. The motherboard wiring board and the base material having a wiring circuit are electrically connected to each other at least one portion through an inner via hole. The outer shape of the base material having a wiring circuit is smaller than the outer shape of the motherboard, with the base material having a wiring circuit having an island shape on the motherboard.
公开/授权文献
- US20090217522A1 PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD 公开/授权日：2009-09-03