公开(公告)号：US07886438B2

公开(公告)日：2011-02-15

申请号：US12463708

申请日：2009-05-11

申请人： Shoji Ito ,  Ryoichi Kishihara ,  Osamu Nakao ,  Hiroki Hashiba ,  Masahiro Okamoto

发明人： Shoji Ito ,  Ryoichi Kishihara ,  Osamu Nakao ,  Hiroki Hashiba ,  Masahiro Okamoto

IPC分类号： H01K3/10

CPC分类号： H01L23/5385 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1627 ,  H01L2924/3511 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/09972 ,  Y10T29/49128 ,  Y10T29/4916 ,  Y10T29/49165 ,  H01L2224/0401

摘要： At least one base material having a wiring circuit that has been formed into a predetermined outer shape is bonded to a motherboard. The motherboard wiring board and the base material having a wiring circuit are electrically connected to each other at least one portion through an inner via hole. The outer shape of the base material having a wiring circuit is smaller than the outer shape of the motherboard, with the base material having a wiring circuit having an island shape on the motherboard.

摘要翻译： 具有形成为预定外形的布线电路的至少一种基材被粘合到母板上。 具有布线电路的主板布线板和基材通过内部通孔相互电连接至少一个部分。 具有布线电路的基材的外形小于母板的外形，母基板具有在主板上具有岛状的布线电路。

公开(公告)号：US20090217522A1

公开(公告)日：2009-09-03

申请号：US12463708

申请日：2009-05-11

申请人： Shoji ITO ,  Ryoichi Kishihara ,  Osamu Nakao ,  Hiroki Hashiba ,  Masahiro Okamoto

发明人： Shoji ITO ,  Ryoichi Kishihara ,  Osamu Nakao ,  Hiroki Hashiba ,  Masahiro Okamoto

IPC分类号： H05K3/10

CPC分类号： H01L23/5385 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1627 ,  H01L2924/3511 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/09972 ,  Y10T29/49128 ,  Y10T29/4916 ,  Y10T29/49165 ,  H01L2224/0401

摘要： At least one base material having a wiring circuit that has been formed into a predetermined outer shape is bonded to a motherboard. The motherboard wiring board and the base material having a wiring circuit are electrically connected to each other at least one portion through an inner via hole. The outer shape of the base material having a wiring circuit is smaller than the outer shape of the motherboard, with the base material having a wiring circuit having an island shape on the motherboard.

摘要翻译： 具有形成为预定外形的布线电路的至少一种基材被粘合到母板上。 具有布线电路的主板布线板和基材通过内部通孔相互电连接至少一个部分。 具有布线电路的基材的外形小于母板的外形，母基板具有在主板上具有岛状的布线电路。

公开(公告)号：US20060180344A1

公开(公告)日：2006-08-17

申请号：US10542649

申请日：2003-12-19

申请人： Shoji Ito ,  Ryoichi Kishihara ,  Osamu Nakao ,  Hiroki Hashiba ,  Masahiro Okamoto

发明人： Shoji Ito ,  Ryoichi Kishihara ,  Osamu Nakao ,  Hiroki Hashiba ,  Masahiro Okamoto

IPC分类号： H05K1/11 ,  H05K1/09 ,  H05K1/03

CPC分类号： H01L23/5385 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1627 ,  H01L2924/3511 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/09972 ,  Y10T29/49128 ,  Y10T29/4916 ,  Y10T29/49165 ,  H01L2224/0401

摘要： At least one base material having a wiring circuit that has been formed into a predetermined outer shape is bonded to a motherboard. The motherboard wiring board and the base material having a wiring circuit are electrically connected to each other at least one portion through an inner via hole. The outer shape of the base material having a wiring circuit is smaller than the outer shape of the motherboard, with the base material having a wiring circuit having an island shape on the motherboard.

摘要翻译： 具有形成为预定外形的布线电路的至少一种基材被粘合到母板上。 具有布线电路的主板布线板和基材通过内部通孔相互电连接至少一个部分。 具有布线电路的基材的外形小于母板的外形，母基板具有在主板上具有岛状的布线电路。