Invention Grant
- Patent Title: Waterproof module for LED lamp
- Patent Title (中): LED灯防水模块
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Application No.: US11952639Application Date: 2007-12-07
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Publication No.: US07887229B2Publication Date: 2011-02-15
- Inventor: Jiahn-Chang Wu
- Applicant: Jiahn-Chang Wu
- Priority: TW96135495A 20070921
- Main IPC: H01R33/00
- IPC: H01R33/00 ; F21V31/00
Abstract:
A waterproof ring unit is located in the opening of a socket. A ring ditch is made around the inner surface of the waterproof ring unit. When a flanged light emitting diode (LED) lamp is inserted into the socket, the ring ditch structurally couples to the flange. The waterproof ring embraces the lamp body to form a waterproof module for the LED lamp.
Public/Granted literature
- US20090080201A1 WATERPROOF MODULE FOR LED LAMP Public/Granted day:2009-03-26
Information query
