Invention Grant
- Patent Title: Phase-change memory element and method for fabricating the same
- Patent Title (中): 相变存储元件及其制造方法
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Application No.: US12405173Application Date: 2009-03-16
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Publication No.: US07888155B2Publication Date: 2011-02-15
- Inventor: Frederick T Chen
- Applicant: Frederick T Chen
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A phase-change memory element is provided. The phase-change memory element includes: a first electrode formed on a substrate; a first dielectric layer, with an opening, formed on the first electrode, wherein the opening exposes a top surface of the first electrode; a pillar structure formed directly on the first electrode within the opening; an inner phase-change material layer surrounding the pillar structure, directly contacting the first electrode; a second dielectric layer surrounding the inner phase-change material layer; an outer phase-change material layer surrounding the second dielectric layer; a phase-change material collar formed between the second dielectric layer and the first electrode, connecting the inner phase-change material layer with the outer phase-change material layer; and a second electrode formed directly on the pillar structure, directly contacting the top surface of the inner phase-change material layer.
Public/Granted literature
- US20100230653A1 PHASE-CHANGE MEMORY ELEMENT AND METHOD FOR FABRICATING THE SAME Public/Granted day:2010-09-16
Information query
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