Phase change memory device and fabrication method thereof
    1.
    发明授权
    Phase change memory device and fabrication method thereof 失效
    相变存储器件及其制造方法

    公开(公告)号:US07678606B2

    公开(公告)日:2010-03-16

    申请号:US11850019

    申请日:2007-09-04

    Inventor: Frederick T Chen

    Abstract: A phase change memory device is disclosed. A second conductive spacer is under a first conductive spacer. A phase change layer comprises a first portion substantially parallel to the first and second conductive spacers and a second portion on top of the second conductive spacer, wherein the second conductive spacer is electrically connected to the first conductive spacer through the second portion of the phase change layer.

    Abstract translation: 公开了一种相变存储器件。 第二导电间隔物位于第一导电间隔物下方。 相变层包括基本上平行于第一和第二导电间隔物的第一部分和位于第二导电间隔物顶部上的第二部分,其中第二导电间隔物通过相变的第二部分电连接到第一导电间隔物 层。

    Non-volatile memory structure and method for fabricating the same
    3.
    发明授权
    Non-volatile memory structure and method for fabricating the same 有权
    非易失性存储器结构及其制造方法

    公开(公告)号:US08624218B2

    公开(公告)日:2014-01-07

    申请号:US13342171

    申请日:2012-01-02

    Inventor: Frederick T Chen

    Abstract: The disclosure provides a non-volatile memory structure and a method for fabricating the same. The non-volatile memory structure includes a first contact connected to a first transistor. A second contact is connected to a second transistor. A resistance-changing memory material pattern covers and contacts the second contact but not the first contact. A top electrode contacts both the resistance-changing memory material pattern and the first contact. An area of the resistance-changing memory material pattern is substantially larger than an area of its interface with the second contact.

    Abstract translation: 本公开提供了一种非易失性存储器结构及其制造方法。 非易失性存储器结构包括连接到第一晶体管的第一触点。 第二触点连接到第二晶体管。 电阻变化记忆材料图案覆盖并接触第二接触件而不是第一接触件。 顶部电极接触电阻变化记忆材料图案和第一接触。 电阻变化记忆材料图案的面积显着大于其与第二接触面的界面的面积。

    Phase change memory devices and methods for manufacturing the same
    4.
    发明授权
    Phase change memory devices and methods for manufacturing the same 有权
    相变存储器件及其制造方法

    公开(公告)号:US07964862B2

    公开(公告)日:2011-06-21

    申请号:US12056227

    申请日:2008-03-26

    Abstract: Phase change memory devices and methods for manufacturing the same are provided. An exemplary embodiment of a phase change memory device includes a first electrode disposed in a first dielectric layer. A second dielectric layer is disposed over the first dielectric layer and the first electrode. A phase change material layer disposed in the second dielectric layer to electrically contact the first electrode. A third dielectric layer is disposed over the second dielectric layer. A second electrode is disposed in the third dielectric layer to electrically connect the phase change material layer and at least one gap disposed in the first dielectric layer or the second dielectric layer to thereby isolate portions of the phase change material layer and portions of the first or second dielectric layer adjacent thereto.

    Abstract translation: 提供了相变存储器件及其制造方法。 相变存储器件的示例性实施例包括设置在第一介电层中的第一电极。 第二电介质层设置在第一电介质层和第一电极之上。 一种相变材料层,设置在第二电介质层中以与第一电极电接触。 第三电介质层设置在第二电介质层上。 第二电极设置在第三电介质层中以将相变材料层和布置在第一介电层或第二介电层中的至少一个间隙电连接,从而隔离相变材料层的部分和第一或 第二电介质层。

    Method of photolithographic exposure
    5.
    发明授权
    Method of photolithographic exposure 有权
    光刻曝光方法

    公开(公告)号:US07781150B2

    公开(公告)日:2010-08-24

    申请号:US11613121

    申请日:2006-12-19

    Inventor: Frederick T Chen

    CPC classification number: G03F7/2022 G03F7/0035 G03F7/095

    Abstract: A method of photolithographic exposure is disclosed. The photolithographic exposure method comprises providing a substrate, forming a first resist layer thereon, forming a second resist layer on the first resist layer, the second resist layer providing a transmission which first increases then decreases as exposure dose increases, and exposing the second resist layer.

    Abstract translation: 公开了一种光刻曝光方法。 光刻曝光方法包括提供基板,在其上形成第一抗蚀剂层,在第一抗蚀剂层上形成第二抗蚀剂层,提供首先增加的透射率的第二抗蚀剂层随着曝光剂量增加而减小,并且暴露第二抗蚀剂层 。

    Phase-change memory element
    6.
    发明授权
    Phase-change memory element 有权
    相变存储元件

    公开(公告)号:US07919768B2

    公开(公告)日:2011-04-05

    申请号:US12172162

    申请日:2008-07-11

    Abstract: A phase-change memory cell is proposed. The phase-change memory includes a bottom electrode; a phase-change spacer formed to contact the bottom electrode; an electrical conductive layer having a vertical portion and a horizontal portion, wherein the electrical conductive layer electrically connects to the phase-change spacer via the horizontal portion; and a top electrode electrically connected to the electrical conductive layer via the vertical portion of the electrically conductive layer.

    Abstract translation: 提出了相变存储单元。 相变存储器包括底部电极; 形成为与底部电极接触的相变间隔件; 导电层,其具有垂直部分和水平部分,其中所述导电层经由所述水平部分电连接到所述相变间隔件; 以及通过导电层的垂直部分与导电层电连接的顶部电极。

    Methods for forming patterns
    7.
    发明授权
    Methods for forming patterns 有权
    形成图案的方法

    公开(公告)号:US07919413B2

    公开(公告)日:2011-04-05

    申请号:US11834579

    申请日:2007-08-06

    Inventor: Frederick T Chen

    CPC classification number: H01L21/0337 H01L21/0338

    Abstract: A method for forming patterns comprises providing a substrate. A set of seed features is formed over the substrate. At least one bi-layer comprising a first layer followed by a second layer is formed on the set of seed features. The first layer and the second layer above the set of seed features are removed. The first layer and the second layer are anisotropically etched successively at least one time to form an opening next to the set of seed features.

    Abstract translation: 用于形成图案的方法包括提供基底。 在衬底上形成一组种子特征。 在该组种子特征上形成至少一个包含第一层和第二层的双层。 去除了一组种子特征之上的第一层和第二层。 第一层和第二层被连续地各向异性蚀刻至少一次,以形成一组种子特征旁边的开口。

    Phase-change memory element and method for fabricating the same
    8.
    发明授权
    Phase-change memory element and method for fabricating the same 有权
    相变存储元件及其制造方法

    公开(公告)号:US07888155B2

    公开(公告)日:2011-02-15

    申请号:US12405173

    申请日:2009-03-16

    Inventor: Frederick T Chen

    CPC classification number: H01L45/144 H01L45/06 H01L45/124 H01L45/1691

    Abstract: A phase-change memory element is provided. The phase-change memory element includes: a first electrode formed on a substrate; a first dielectric layer, with an opening, formed on the first electrode, wherein the opening exposes a top surface of the first electrode; a pillar structure formed directly on the first electrode within the opening; an inner phase-change material layer surrounding the pillar structure, directly contacting the first electrode; a second dielectric layer surrounding the inner phase-change material layer; an outer phase-change material layer surrounding the second dielectric layer; a phase-change material collar formed between the second dielectric layer and the first electrode, connecting the inner phase-change material layer with the outer phase-change material layer; and a second electrode formed directly on the pillar structure, directly contacting the top surface of the inner phase-change material layer.

    Abstract translation: 提供了相变存储元件。 相变存储元件包括:形成在基板上的第一电极; 具有开口的第一电介质层,形成在所述第一电极上,其中所述开口暴露所述第一电极的顶表面; 直立在开口内的第一电极上的柱结构; 围绕所述柱结构的内相变材料层,直接接触所述第一电极; 围绕所述内相变材料层的第二介电层; 围绕所述第二介电层的外相变材料层; 形成在所述第二电介质层和所述第一电极之间的相变材料套环,将所述内部相变材料层与所述外部相变材料层连接; 以及直接形成在柱状结构上的与内部相变材料层的顶面直接接触的第二电极。

    Phase-change memory element
    9.
    发明授权
    Phase-change memory element 有权
    相变存储元件

    公开(公告)号:US07679163B2

    公开(公告)日:2010-03-16

    申请号:US11748440

    申请日:2007-05-14

    Abstract: A phase-change memory element for reducing heat loss is disclosed. The phase-change memory element comprises a composite layer, wherein the composite layer comprises a dielectric material and a low thermal conductivity material. A via hole is formed within the composite layer. A phase-change material occupies at least one portion of the via hole. The composite layer comprises alternating layers or a mixture of the dielectric material and the low thermal conductivity material.

    Abstract translation: 公开了一种用于减少热损失的相变存储元件。 相变存储元件包括复合层,其中复合层包括电介质材料和低热导率材料。 在复合层内形成通孔。 相变材料占据通孔的至少一部分。 复合层包括交替的层或介电材料和低热导率材料的混合物。

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