Invention Grant
- Patent Title: Electronic fuse having heat spreading structure
- Patent Title (中): 具有散热结构的电子保险丝
-
Application No.: US12013290Application Date: 2008-01-11
-
Publication No.: US07888772B2Publication Date: 2011-02-15
- Inventor: Dae-Jin Kwon , Woo-Sik Kim , Maeda Shigenobu , Seung-Hwan Lee , Sung-Rey Wi , Wang-Xiao Quan , Hyun-Min Choi
- Applicant: Dae-Jin Kwon , Woo-Sik Kim , Maeda Shigenobu , Seung-Hwan Lee , Sung-Rey Wi , Wang-Xiao Quan , Hyun-Min Choi
- Applicant Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Consulting, PLLC
- Priority: KR10-2007-0005419 20070117
- Main IPC: H01L29/00
- IPC: H01L29/00
Abstract:
A semiconductor device includes a fuse transistor for fuse programming and a fuse block connected to the fuse transistor, wherein the fuse block comprises a fuse line and a heat spreading structure connected to the fuse line. The electrical fuse employs the heat spreading structure connected to the fuse line to prevent a rupture of the electrical fuse such that heat, which is generated in the fuse line during a blowing of the fuse line, is spread throughout the heat spreading structure. Thus, a sensing margin of the electrical fuse can be secured and a deterioration of devices adjacent to the electrical fuse by heat generated in the electrical fuse can be prevented.
Public/Granted literature
- US20080211059A1 ELECTRONIC FUSE HAVING HEAT SPREADING STRUCTURE Public/Granted day:2008-09-04
Information query
IPC分类:
