发明授权
- 专利标题： Electromagnetically coupled interconnect system architecture
- 专利标题（中）： 电磁耦合互连系统架构
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申请号： US12611545申请日： 2009-11-03
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公开(公告)号： US07889022B2公开(公告)日： 2011-02-15
- 发明人: Charles A. Miller
- 申请人： Charles A. Miller
- 申请人地址： US CA Livermore
- 专利权人： FormFactor, Inc.
- 当前专利权人： FormFactor, Inc.
- 当前专利权人地址： US CA Livermore
- 代理机构： Kirton & McConkie
- 主分类号： H01P5/02
- IPC分类号： H01P5/02 ; H01P5/18
摘要：
An electromagnetic interconnect method and apparatus effects contactless, proximity connections between elements in an electronics system. Data to be communicated between elements in an electronic system are modulated into a carrier signal and transmitted contactlessly by electromagnetic coupling. The electromagnetic coupling may be directly between elements in the system or through an intermediary transmission medium.
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