发明授权
- 专利标题： Optical sensor including stacked photodiodes
- 专利标题（中）： 光学传感器包括堆叠的光电二极管
-
申请号： US12129716申请日： 2008-05-30
-
公开(公告)号： US07893468B2公开(公告)日： 2011-02-22
- 发明人: Jeffrey P. Gambino , Daniel N. Maynard , Kevin N. Ogg , Richard J. Rassel , Raymond J. Rosner
- 申请人： Jeffrey P. Gambino , Daniel N. Maynard , Kevin N. Ogg , Richard J. Rassel , Raymond J. Rosner
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Scully, Scott, Murphy & Presser, P.C.
- 代理商 Anthony Canale
- 主分类号： H01L29/72
- IPC分类号： H01L29/72
摘要：
A complementary metal-oxide-semiconductor (CMOS) image sensor comprises a first photosensitive diode comprising a first semiconductor material is formed in a first semiconductor substrate. A second photosensitive diode comprising a second semiconductor material, which has a different light detection wavelength range than the first semiconductor material, is formed in a second semiconductor substrate. Semiconductor devices for holding and detecting charges comprising a sensing circuit of the CMOS image sensor may also be formed in the second semiconductor substrate. The first semiconductor substrate and the second semiconductor substrate are bonded so that the first photosensitive diode is located underneath the second photosensitive diode. The vertical stack of the first and second photosensitive diodes detects light in the combined detection wavelength range of the first and second semiconductor materials. Sensing devices may be shared between the first and second photosensitive diodes.
公开/授权文献
- US20090294813A1 Optical Sensor Including Stacked Photodiodes 公开/授权日：2009-12-03
信息查询
IPC分类:
