Invention Grant
- Patent Title: Methods of fabricating vertical twin-channel transistors
- Patent Title (中): 制造垂直双通道晶体管的方法
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Application No.: US12651688Application Date: 2010-01-04
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Publication No.: US07897463B2Publication Date: 2011-03-01
- Inventor: Eun-Jung Yun , Sung-Young Lee , Min-Sang Kim , Sung-Min Kim , Hye-Jin Cho
- Applicant: Eun-Jung Yun , Sung-Young Lee , Min-Sang Kim , Sung-Min Kim , Hye-Jin Cho
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR2006-74202 20060807
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A transistor includes first and second pairs of vertically overlaid source/drain regions on a substrate. Respective first and second vertical channel regions extend between the overlaid source/drain regions of respective ones of the first and second pairs of overlaid source/drain regions. Respective first and second insulation regions are disposed between the overlaid source/drain regions of the respective first and second pairs of overlaid source/drain regions and adjacent respective ones of the first and second vertical channel regions. Respective first and second gate insulators are disposed on respective ones of the first and second vertical channel regions. A gate electrode is disposed between the first and second gate insulators. The first and second vertical channel regions may be disposed near adjacent edges of the overlaid source/drain regions.
Public/Granted literature
- US20100105181A1 METHODS OF FABRICATING VERTICAL TWIN-CHANNEL TRANSISTORS Public/Granted day:2010-04-29
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