发明授权
- 专利标题: Laser processing method and chip
- 专利标题(中): 激光加工方法和芯片
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申请号: US11822151申请日: 2007-07-02
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公开(公告)号: US07897487B2公开(公告)日: 2011-03-01
- 发明人: Ryuji Sugiura , Takeshi Sakamoto
- 申请人: Ryuji Sugiura , Takeshi Sakamoto
- 申请人地址: JP Hamamatsu-shi, Shizuoka
- 专利权人: Hamamatsu Photonics K.K.
- 当前专利权人: Hamamatsu Photonics K.K.
- 当前专利权人地址: JP Hamamatsu-shi, Shizuoka
- 代理机构: Drinker Biddle & Reath LLP
- 优先权: JPP2006-183498 20060703; JPP2006-221161 20060814
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
An object to be processed can be cut highly accurately along a line to cut.An object to be processed 1 is irradiated with laser light while locating a converging point within a silicon wafer 11, and the converging point is relatively moved along a line to cut 5, so as to form modified regions M1, M2 positioned within the object 1 along the line to cut 5, and then a modified region M3 positioned between the modified regions M1, M2 within the object 1.
公开/授权文献
- US20080000884A1 Laser processing method and chip 公开/授权日:2008-01-03