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发明授权
US07898286B2 Critical path redundant logic for mitigation of hardware across chip variation 有权
用于缓解跨芯片变化的硬件的关键路径冗余逻辑

Critical path redundant logic for mitigation of hardware across chip variation
摘要：
Cross-die connection structure and method for a die or chip includes buffer elements having a buffer driver and bypass, and control lines coupled to the buffer elements in order to select one of the buffer driver and bypass for each respective buffer element. A logic network is arranged with the buffer elements to form functional paths, a test unit is structured and arranged to test the functional paths and to be coupled to the control lines, and a configuration storage register to set the selected one of the buffer driver and bypass for each passing functional path.
摘要（中）：

用于管芯或芯片的跨管芯连接结构和方法包括具有缓冲器驱动器和旁路的缓冲器元件以及耦合到缓冲器元件的控制线，以便为每个相应的缓冲元件选择缓冲器驱动器和旁路中的一个。 逻辑网络被布置成具有缓冲元件以形成功能路径，测试单元被构造和布置以测试功能路径并耦合到控制线，以及配置存储寄存器，用于设置所选缓冲器驱动器和 绕过每个通过的功能路径。

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