Invention Grant
- Patent Title: Method for fabricating high-quality semiconductor light-emitting devices on silicon substrates
- Patent Title (中): 在硅衬底上制造高品质半导体发光器件的方法
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Application No.: US12067690Application Date: 2006-11-17
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Publication No.: US07902556B2Publication Date: 2011-03-08
- Inventor: Fengyi Jiang , Bilin Shao , Li Wang , Wenqing Fang
- Applicant: Fengyi Jiang , Bilin Shao , Li Wang , Wenqing Fang
- Applicant Address: CN Nanchanj
- Assignee: Lattice Power (Jiangxi) Corporation
- Current Assignee: Lattice Power (Jiangxi) Corporation
- Current Assignee Address: CN Nanchanj
- Agency: Park, Vaughan, Fleming & Dowler LLP
- Agent Shun Yao
- Priority: CN200510110566 20051117
- International Application: PCT/CN2006/003098 WO 20061117
- International Announcement: WO2007/056956 WO 20070524
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
One embodiment of the present invention provides a semiconductor light-emitting device which includes: (1) a silicon (Si) substrate; (2) a silver (Ag) transition layer which is formed on a surface of the Si substrate, wherein the Ag transition layer covers the Si substrate surface; and (3) an InGaAlN, ZnMgCdO, or ZnBeCdO-based semiconductor light-emitting structure which is fabricated on the Ag-coated Si substrate. Note that the Ag transition layer prevents the Si substrate surface from forming an amorphous overcoat with reactant gases used for growing the semiconductor light-emitting structure.
Public/Granted literature
- US20080210951A1 Method For Fabricating High-Quality Semiconductor Light-Emitting Devices On Silicon Substrates Public/Granted day:2008-09-04
Information query
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