Invention Grant
- Patent Title: Semiconductor laser device and method of manufacturing the same
- Patent Title (中): 半导体激光器件及其制造方法
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Application No.: US12357282Application Date: 2009-01-21
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Publication No.: US07903709B2Publication Date: 2011-03-08
- Inventor: Ryoji Hiroyama , Daijiro Inoue , Yasuyuki Bessho , Masayuki Hata
- Applicant: Ryoji Hiroyama , Daijiro Inoue , Yasuyuki Bessho , Masayuki Hata
- Applicant Address: JP Osaka
- Assignee: Sanyo Electric Co., Ltd.
- Current Assignee: Sanyo Electric Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Ditthavong Mori & Steiner, P.C.
- Priority: JP2008-010202 20080121; JP2009-006780 20090115
- Main IPC: H01S5/00
- IPC: H01S5/00

Abstract:
A semiconductor laser device includes a substrate and a semiconductor layer formed on a surface of the substrate and having a waveguide extending in a first direction parallel to the surface, wherein the waveguide is formed on a region approaching a first side from a center of the semiconductor laser device in a second direction parallel to the surface and intersecting with the first direction, a first region separated from the waveguide on a side opposite to the first side of the waveguide and extending parallel to the first direction and a first recess portion separated from the waveguide on an extension of a facet of the waveguide, intersecting with the first region and extending in the second direction are formed on an upper surface of the semiconductor laser device, and a thickness of the semiconductor layer on the first region is smaller than a thickness of the semiconductor layer on a region other than the first region.
Public/Granted literature
- US20090185594A1 SEMICONDUCTOR LASER DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2009-07-23
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