发明授权
- 专利标题: Semiconductor laser device and method of manufacturing the same
- 专利标题(中): 半导体激光器件及其制造方法
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申请号: US12357282申请日: 2009-01-21
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公开(公告)号: US07903709B2公开(公告)日: 2011-03-08
- 发明人: Ryoji Hiroyama , Daijiro Inoue , Yasuyuki Bessho , Masayuki Hata
- 申请人: Ryoji Hiroyama , Daijiro Inoue , Yasuyuki Bessho , Masayuki Hata
- 申请人地址: JP Osaka
- 专利权人: Sanyo Electric Co., Ltd.
- 当前专利权人: Sanyo Electric Co., Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: Ditthavong Mori & Steiner, P.C.
- 优先权: JP2008-010202 20080121; JP2009-006780 20090115
- 主分类号: H01S5/00
- IPC分类号: H01S5/00
摘要:
A semiconductor laser device includes a substrate and a semiconductor layer formed on a surface of the substrate and having a waveguide extending in a first direction parallel to the surface, wherein the waveguide is formed on a region approaching a first side from a center of the semiconductor laser device in a second direction parallel to the surface and intersecting with the first direction, a first region separated from the waveguide on a side opposite to the first side of the waveguide and extending parallel to the first direction and a first recess portion separated from the waveguide on an extension of a facet of the waveguide, intersecting with the first region and extending in the second direction are formed on an upper surface of the semiconductor laser device, and a thickness of the semiconductor layer on the first region is smaller than a thickness of the semiconductor layer on a region other than the first region.
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