Invention Grant
US07906374B2 COF packaging structure, method of manufacturing the COF packaging structure, and method for assembling a driver IC and the COF packaging structure thereof
失效
COF包装结构，COF包装结构的制造方法，以及组装驱动IC的方法及其COF包装结构
- Patent Title: COF packaging structure, method of manufacturing the COF packaging structure, and method for assembling a driver IC and the COF packaging structure thereof
- Patent Title (中): COF包装结构，COF包装结构的制造方法，以及组装驱动IC的方法及其COF包装结构
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Application No.: US12057387Application Date: 2008-03-28
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Publication No.: US07906374B2Publication Date: 2011-03-15
- Inventor: Chiu-Shun Lin , Pai-Sheng Cheng
- Applicant: Chiu-Shun Lin , Pai-Sheng Cheng
- Applicant Address: TW Fonghua Village, Sinshih Township, Tainan County
- Assignee: Himax Technologies Limited
- Current Assignee: Himax Technologies Limited
- Current Assignee Address: TW Fonghua Village, Sinshih Township, Tainan County
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A COF packaging structure includes a substrate, a first conductive foil, and a second conductive foil. The substrate has a first surface and a second surface opposite to the first surface. The first conductive foil is disposed on the first surface of the substrate and has a first designated pattern for bump bonding. The second conductive foil is disposed on the second surface of the substrate and has a second designated pattern, wherein the area of the second designated pattern is not smaller than the area of the first designated pattern.
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