An electronic device includes a first molded body having a first frame, the first molded body being provided with a conductive pattern on its outer surface, a second molded body having a second frame, the second molded body being joined to the first molded body, a wiring sheet made of an insulative sheet provided with an interconnection pattern, a circuit board having a feed point, and a feed line having a first end extended to a mating surface of the first frame opposed to the second frame and a second end connected to the conductive pattern. The interconnection pattern has a first end connected to the one end of the feed line. The interconnection pattern has a second end connected to the feed point.