Invention Grant
- Patent Title: Ultrasonic probe and manufacturing process thereof
- Patent Title (中): 超声波探头及其制造工艺
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Application No.: US11891106Application Date: 2007-08-09
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Publication No.: US07913366B2Publication Date: 2011-03-29
- Inventor: Yoshihiro Tahara , Isamu Shimura , Takashi Kondoh
- Applicant: Yoshihiro Tahara , Isamu Shimura , Takashi Kondoh
- Applicant Address: JP Tokyo
- Assignee: Nihon Dempa Kogyo Co., Ltd.
- Current Assignee: Nihon Dempa Kogyo Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Edwards Angell Palmer & Dodge LLP
- Agent Scott D. Wofsy
- Priority: JP2004-132495 20040428
- Main IPC: H04R17/10
- IPC: H04R17/10

Abstract:
A manufacturing method for an ultrasonic probe including the steps of forming a plurality of unit fixing plates. Laminating each unit fixing plates to one another to form a fixing base and inserting lead wires into grooves formed in the fixing base. Partially cutting away and smoothing both principal surfaces of the fixing base to expose lead wires. Fixing a piezoelectric plate to one principal surface of the fixing base and cutting out between the lead wires in a one dimension direction and a two dimension direction, to divide up said piezoelectric plate and the fixing base into a plurality of piezoelectric elements.
Public/Granted literature
- US20080294053A1 Ultrasonic probe and manufacturing process thereof Public/Granted day:2008-11-27
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