-
公开(公告)号：US20080294053A1
公开(公告)日：2008-11-27
申请号：US11891106
申请日：2007-08-09
Applicant: Yoshihiro Tahara , Isamu Shimura , Takashi Kondoh
Inventor： Yoshihiro Tahara , Isamu Shimura , Takashi Kondoh
IPC: A61B8/00
CPC classification number: B06B1/0629 , Y10T29/42 , Y10T29/49005 , Y10T29/49147 , Y10T29/49165
Abstract: The invention relates to an ultrasonic probe in which the array accuracy of lead wires, and heat resistance when connecting to a connector are enhanced, and a manufacturing method therefor. The ultrasonic probe of the invention is one in which a plurality of piezoelectric elements are arrayed in a two-dimensional direction on a fixing base, and lead wires from the lower surface of each of the piezoelectric elements are inserted through the fixing base, and the electrically connected lead wires are led out, and the fixing base has an opening portion in an array direction of the piezoelectric elements, and comprises unit fixing plates laminated in the array direction, and grooves through which the lead wires are inserted, are formed on one principal surface of the unit fixing plates, and damper material is filled into the opening portion. The invention is also for a manufacturing method for the ultrasonic probe.
Abstract translation: 本发明涉及一种超声波探头及其制造方法，其中引线的阵列精度以及连接到连接器时的耐热性提高。 本发明的超声波探头是将多个压电元件沿着二维方向排列在固定基座上，并且来自每个压电元件的下表面的引线通过固定基座插入， 电连接的引线被引出，并且固定基座具有在压电元件的排列方向上的开口部分，并且包括沿阵列方向层叠的单元固定板，以及在其上插入引线的沟槽 单元固定板的主表面和阻尼材料填充到开口部分中。 本发明也用于超声波探头的制造方法。
-
公开(公告)号：US20050242689A1
公开(公告)日：2005-11-03
申请号：US11111170
申请日：2005-04-21
Applicant: Yoshihiro Tahara , Isamu Shimura , Takashi Kondoh
Inventor： Yoshihiro Tahara , Isamu Shimura , Takashi Kondoh
CPC classification number: B06B1/0629 , Y10T29/42 , Y10T29/49005 , Y10T29/49147 , Y10T29/49165
Abstract: The invention relates to an ultrasonic probe in which the array accuracy of lead wires, and heat resistance when connecting to a connector are enhanced, and a manufacturing method therefor. The ultrasonic probe of the invention is one in which a plurality of piezoelectric elements are arrayed in a two-dimensional direction on a fixing base, and lead wires from the lower surface of each of the piezoelectric elements are inserted through the fixing base, and the electrically connected lead wires are led out, and the fixing base has an opening portion in an array direction of the piezoelectric elements, and comprises unit fixing plates laminated in the array direction, and grooves through which the lead wires are inserted, are formed on one principal surface of the unit fixing plates, and damper material is filled into the opening portion. The invention is also for a manufacturing method for the ultrasonic probe.
Abstract translation: 本发明涉及一种超声波探头及其制造方法，其中引线的阵列精度以及连接到连接器时的耐热性提高。 本发明的超声波探头是将多个压电元件沿着二维方向排列在固定基座上，并且来自每个压电元件的下表面的引线通过固定基座插入， 电连接的引线被引出，并且固定基座具有在压电元件的排列方向上的开口部分，并且包括沿阵列方向层叠的单元固定板，以及在其上插入引线的沟槽 单元固定板的主表面和阻尼材料填充到开口部分中。 本发明也用于超声波探头的制造方法。
-
公开(公告)号：US07913366B2
公开(公告)日：2011-03-29
申请号：US11891106
申请日：2007-08-09
Applicant: Yoshihiro Tahara , Isamu Shimura , Takashi Kondoh
Inventor： Yoshihiro Tahara , Isamu Shimura , Takashi Kondoh
IPC: H04R17/10
CPC classification number: B06B1/0629 , Y10T29/42 , Y10T29/49005 , Y10T29/49147 , Y10T29/49165
Abstract: A manufacturing method for an ultrasonic probe including the steps of forming a plurality of unit fixing plates. Laminating each unit fixing plates to one another to form a fixing base and inserting lead wires into grooves formed in the fixing base. Partially cutting away and smoothing both principal surfaces of the fixing base to expose lead wires. Fixing a piezoelectric plate to one principal surface of the fixing base and cutting out between the lead wires in a one dimension direction and a two dimension direction, to divide up said piezoelectric plate and the fixing base into a plurality of piezoelectric elements.
Abstract translation: 一种超声波探头的制造方法，包括形成多个单元固定板的步骤。 将每个单元固定板彼此层压以形成固定基座并将引线插入形成在固定基座中的凹槽中。 部分切割并平滑固定底座的两个主表面以露出引线。 将压电板固定在固定基座的一个主表面上，并在一维方向和二维方向上在引线之间切割，将所述压电板和固定基座分成多个压电元件。
-
公开(公告)号：US07312556B2
公开(公告)日：2007-12-25
申请号：US11111170
申请日：2005-04-21
Applicant: Yoshihiro Tahara , Isamu Shimura , Takashi Kondoh
Inventor： Yoshihiro Tahara , Isamu Shimura , Takashi Kondoh
CPC classification number: B06B1/0629 , Y10T29/42 , Y10T29/49005 , Y10T29/49147 , Y10T29/49165
Abstract: The invention relates to an ultrasonic probe in which the array accuracy of lead wires, and heat resistance when connecting to a connector are enhanced, and a manufacturing method therefor. The ultrasonic probe of the invention is one in which a plurality of piezoelectric elements are arrayed in a two-dimensional direction on a fixing base, and lead wires from the lower surface of each of the piezoelectric elements are inserted through the fixing base, and the electrically connected lead wires are led out, and the fixing base has an opening portion in an array direction of the piezoelectric elements, and comprises unit fixing plates laminated in the array direction, and grooves through which the lead wires are inserted, are formed on one principal surface of the unit fixing plates, and damper material is filled into the opening portion. The invention is also for a manufacturing method for the ultrasonic probe.
Abstract translation: 本发明涉及一种超声波探头及其制造方法，其中引线的阵列精度以及连接到连接器时的耐热性提高。 本发明的超声波探头是将多个压电元件沿着二维方向排列在固定基座上，并且来自每个压电元件的下表面的引线通过固定基座插入， 电连接的引线被引出，并且固定基座具有在压电元件的排列方向上的开口部分，并且包括沿阵列方向层叠的单元固定板，以及在其上插入引线的沟槽 单元固定板的主表面和阻尼材料填充到开口部分中。 本发明也用于超声波探头的制造方法。
-
-
-
Search Results
4
records
(took 0.01 seconds)
