发明授权
- 专利标题: Method of forming a trench capacitor
- 专利标题(中): 形成沟槽电容器的方法
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申请号: US11953481申请日: 2007-12-10
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公开(公告)号: US07915133B2公开(公告)日: 2011-03-29
- 发明人: Kuo-Yao Cho , Wen-Bin Wu , Chiang-Lin Shih , Jen-Jui Huang
- 申请人: Kuo-Yao Cho , Wen-Bin Wu , Chiang-Lin Shih , Jen-Jui Huang
- 申请人地址: CN Taiwan
- 专利权人: Nanya Technology Corp.
- 当前专利权人: Nanya Technology Corp.
- 当前专利权人地址: CN Taiwan
- 代理机构: Ingrassia Fisher & Lorenz, P.C.
- 优先权: TW96117177A 20070515
- 主分类号: H01L21/20
- IPC分类号: H01L21/20
摘要:
A method of forming a ring-type capacitor is provided. The method includes providing a substrate; forming a patterned mask layer on the substrate, the patterned mask layer defining a ring pattern; removing the substrate by using the patterned mask layer as a mask to form a ring-type trench in the substrate; the ring-type trench including an inner wall and an outer wall; and forming a capacitor structure on the inner wall and the outer wall of the ring-type trench.
公开/授权文献
- US20080286934A1 METHOD OF FORMING A TRENCH CAPACITOR 公开/授权日:2008-11-20
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