发明授权
- 专利标题: Semiconductor memory device and method for manufacturing the same
- 专利标题(中): 半导体存储器件及其制造方法
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申请号: US12391953申请日: 2009-02-24
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公开(公告)号: US07915156B2公开(公告)日: 2011-03-29
- 发明人: Kenji Aoyama , Eiji Ito , Masahiro Kiyotoshi , Tadashi Iguchi , Moto Yabuki
- 申请人: Kenji Aoyama , Eiji Ito , Masahiro Kiyotoshi , Tadashi Iguchi , Moto Yabuki
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- 优先权: JP2008-044481 20080226
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
A semiconductor memory device has a semiconductor substrate, a plurality of word lines formed at predetermined intervals on the semiconductor substrate, each word line having a gate insulating film, a charge storage layer, a first insulating film, and a controlling gate electrode which are stacked in order, and including a metal oxide layer above the level of the gate insulating film, a second insulating film covering a side of the word line and a surface of the semiconductor substrate between the word lines, and having a film thickness of 15 nm or less, and a third insulating film formed between the word lines adjacent to each other such that a region below the level of the metal oxide layer has a cavity.
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