发明授权
- 专利标题: Fabrication of channel wraparound gate structure for field-effect transistor
- 专利标题(中): 场效应晶体管通道环绕栅结构的制作
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申请号: US11240440申请日: 2005-09-29
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公开(公告)号: US07915167B2公开(公告)日: 2011-03-29
- 发明人: Marko Radosavljevic , Amlan Majumdar , Suman Datta , Jack Kavalieros , Brian S. Doyle , Justin K. Brask , Robert S. Chau
- 申请人: Marko Radosavljevic , Amlan Majumdar , Suman Datta , Jack Kavalieros , Brian S. Doyle , Justin K. Brask , Robert S. Chau
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号: H01L21/302
- IPC分类号: H01L21/302
摘要:
A method for fabricating a field-effect transistor with a gate completely wrapping around a channel region is described. Ion implantation is used to make the oxide beneath the channel region of the transistor more etchable, thereby allowing the oxide to be removed below the channel region. Atomic layer deposition is used to form a gate dielectric and a metal gate entirely around the channel region once the oxide is removed below the channel region.
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