Over the air or radiated testing of an RF microelectronic or integrated circuit device under test (DUT) that has an integrated millimeter wave (mmw) antenna structure, is described. The antenna structure may have multiple elements in an array design that may be driven and/or sensed by integrated RF transmitter and/or receiver circuitry. An interface printed wiring board (e.g., a tester load board or a wafer probe card assembly) has formed in it a mmw radiation passage that is positioned to pass mmw radiation to and/or from the integrated antenna of the DUT. Test equipment may be conductively coupled to contact points of the interface board, to transmit and/or receive signals for testing of the DUT and/or provide dc power to the DUT. A test antenna is designed and positioned to receive and/or transmit mmw radiation through the passage, from and/or to the integrated DUT antenna. Other embodiments are also described and claimed.