公开(公告)号：US07915909B2

公开(公告)日：2011-03-29

申请号：US12059757

申请日：2008-03-31

申请人： Clifford J. Dunn ,  George Palmer ,  Jeffrey M. Gilbert

发明人： Clifford J. Dunn ,  George Palmer ,  Jeffrey M. Gilbert

IPC分类号： G01R31/00

CPC分类号： G01R31/2822

摘要： Over the air or radiated testing of an RF microelectronic or integrated circuit device under test (DUT) that has an integrated millimeter wave (mmw) antenna structure, is described. The antenna structure may have multiple elements in an array design that may be driven and/or sensed by integrated RF transmitter and/or receiver circuitry. An interface printed wiring board (e.g., a tester load board or a wafer probe card assembly) has formed in it a mmw radiation passage that is positioned to pass mmw radiation to and/or from the integrated antenna of the DUT. Test equipment may be conductively coupled to contact points of the interface board, to transmit and/or receive signals for testing of the DUT and/or provide dc power to the DUT. A test antenna is designed and positioned to receive and/or transmit mmw radiation through the passage, from and/or to the integrated DUT antenna. Other embodiments are also described and claimed.

摘要翻译： 描述了具有集成毫米波（mmw）天线结构的RF微电子或被测试的集成电路器件（DUT）的空中或辐射测试（DUT）。 天线结构可以具有可由集成RF发射器和/或接收器电路驱动和/或感测的阵列设计中的多个元件。 接口印刷电路板（例如，测试仪负载板或晶片探针卡组件）中形成有一个mmw辐射通道，该辐射通道定位成通过与DUT的集成天线之间的辐射。 测试设备可以导电耦合到接口板的接触点，以发射和/或接收用于测试DUT的信号和/或向DUT提供直流电力。 测试天线被设计和定位成接收和/或传输穿过通道，从和/或到集成的DUT天线的mmw辐射。 还描述和要求保护其他实施例。

公开(公告)号：US20090153158A1

公开(公告)日：2009-06-18

申请号：US12059757

申请日：2008-03-31

申请人： Clifford J. Dunn ,  George Palmer ,  Jeffrey M. Gilbert

发明人： Clifford J. Dunn ,  George Palmer ,  Jeffrey M. Gilbert

IPC分类号： G01R31/303

CPC分类号： G01R31/2822

摘要： Over the air or radiated testing of an RF microelectronic or integrated circuit device under test (DUT) that has an integrated millimeter wave (mmw) antenna structure, is described. The antenna structure may have multiple elements in an array design that may be driven and/or sensed by integrated RF transmitter and/or receiver circuitry. An interface printed wiring board (e.g., a tester load board or a wafer probe card assembly) has formed in it a mmw radiation passage that is positioned to pass mmw radiation to and/or from the integrated antenna of the DUT. Test equipment may be conductively coupled to contact points of the interface board, to transmit and/or receive signals for testing of the DUT and/or provide dc power to the DUT. A test antenna is designed and positioned to receive and/or transmit mmw radiation through the passage, from and/or to the integrated DUT antenna. Other embodiments are also described and claimed.

摘要翻译： 描述了具有集成毫米波（mmw）天线结构的RF微电子或被测试的集成电路器件（DUT）的空中或辐射测试（DUT）。 天线结构可以具有可由集成RF发射器和/或接收器电路驱动和/或感测的阵列设计中的多个元件。 接口印刷电路板（例如，测试仪负载板或晶片探针卡组件）中形成有一个mmw辐射通道，该辐射通道定位成通过与DUT的集成天线之间的辐射。 测试设备可以导电耦合到接口板的接触点，以发射和/或接收用于测试DUT的信号和/或向DUT提供直流电力。 测试天线被设计和定位成接收和/或传输穿过通道，从和/或到集成的DUT天线的mmw辐射。 还描述和要求保护其他实施例。