发明授权
- 专利标题： Method for thinning substrate and method for manufacturing circuit device
- 专利标题（中）： 薄板化方法及制造电路器件的方法
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申请号： US11517157申请日： 2006-09-07
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公开(公告)号： US07919394B2公开(公告)日： 2011-04-05
- 发明人: Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao
- 申请人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao
- 申请人地址： JP Kanagawa
- 专利权人： Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人： Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人地址： JP Kanagawa
- 代理机构： Carrier Blackman & Associates, P.C.
- 代理商 Joseph P. Carrier; William D. Blackman
- 优先权： JP2005-260469 20050908
- 主分类号： H01L21/30
- IPC分类号： H01L21/30 ; H01L21/46
摘要：
A method for thinning a substrate and a method for manufacturing a circuit device which make it possible to prevent the pattern of penetrating holes of a supporting plate from being transferred to the surface of the substrate and prevent non-uniform grinding of the surface of the substrate from occurring. The supporting plate and the substrate are joined by using an adhesive layer, and a sheet is attached to the supporting plate. The surface of the supporting plate to which the sheet has been attached is mounted and fixed by attraction onto an attracting head. The surface of the semiconductor wafer on which no circuit device is formed is ground by a grinder in this state.