发明授权
- 专利标题： Structure and method for sealing cavity of micro-electro-mechanical device
- 专利标题（中）： 微电机械密封腔的结构和方法
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申请号： US12405403申请日： 2009-03-17
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公开(公告)号： US07919842B2公开(公告)日： 2011-04-05
- 发明人: Christopher D. Manack , Steven A. Kummerl
- 申请人： Christopher D. Manack , Steven A. Kummerl
- 申请人地址： US TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： US TX Dallas
- 代理商 Yingsheng Tung; Wade J. Brady, III; Frederick J. Telecky, Jr.
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/488
摘要：
A cavity package (100) for micrometer-scale MEMS devices surrounding the cavity (210) with the MEMS device (220) with a rim (232) of solder-wettable metal, and then covering the cavity with a roof (240) of solder spanning from rim to rim. A solder body, placed over the cavity to rest on the rim, is reflowed; the surface tension of the liquid solder is reduced by the interfacial tension of the rim metal so that the liquid solder spreads over the rim surface and thereby stretches the liquid ball to a plate-like roof over the cavity. After solidifying the solder, the solder-to-metal seal renders the cavity package hermetic.
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