Invention Grant
- Patent Title: Thermal analysis apparatus
- Patent Title (中): 热分析仪
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Application No.: US11861332Application Date: 2007-09-26
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Publication No.: US07922386B2Publication Date: 2011-04-12
- Inventor: Nobuhiro Tanaka
- Applicant: Nobuhiro Tanaka
- Applicant Address: JP Akishima-Shi, Tokyo
- Assignee: Rigaku Corporation
- Current Assignee: Rigaku Corporation
- Current Assignee Address: JP Akishima-Shi, Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2006-262561 20060927
- Main IPC: G01N25/00
- IPC: G01N25/00

Abstract:
A thermal analysis apparatus includes: a sample temperature control device for surrounding a sample placed on a measurement position and controlling the temperature of the sample; a balance beam for supporting the sample and capable of tilting about a pivot point; and a sample moving device that allows the balance beam to slide between a first position at which the sample is situated at the measurement position and a second position at which the sample is situated at a distant position which is a position outside the sample temperature control unit. The distant position is a position which is deviated laterally from a line trajectory extending from the measurement position to the outside of the sample temperature control device. When the sample is at the measurement position, the balance beam is allowed to linearly slide and subsequently to rotationally slide about an axial line, to thereby transport the sample from the measurement position to the distant position.
Public/Granted literature
- US20080181281A1 THERMAL ANALYSIS APPARATUS Public/Granted day:2008-07-31
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