发明授权
- 专利标题: Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods
- 专利标题(中): 具有高导热性和低热膨胀系数的复合材料和散热基板及其制造方法
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申请号: US11678391申请日: 2007-02-23
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公开(公告)号: US07923103B2公开(公告)日: 2011-04-12
- 发明人: Hideko Fukushima
- 申请人: Hideko Fukushima
- 申请人地址: JP Tokyo
- 专利权人: Hitachi Metals, Ltd.
- 当前专利权人: Hitachi Metals, Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Sughrue Mion, PLLC
- 优先权: JP2003-138121 20030516
- 主分类号: B32B5/18
- IPC分类号: B32B5/18 ; B32B15/00
摘要:
A composite material having a high thermal conductivity and a small thermal expansion coefficient, which is obtained by impregnating a porous graphitized extrudate with a metal; the composite material having such anisotropy that the thermal conductivity and the thermal expansion coefficient are 250 W/mK a more and less than 4×10−6/K, respectively, in an extrusion direction; and that the thermal conductivity and the thermal expansion coefficient are 150 W/mK or more and 10×10−6/K or less, respectively, in a direction perpendicular to the extrusion direction.
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