Invention Grant
US07923393B2 Low melting point frit paste composition and sealing method for electric element using the same
失效
低熔点玻璃料糊组合物和电气元件的密封方法使用它
- Patent Title: Low melting point frit paste composition and sealing method for electric element using the same
- Patent Title (中): 低熔点玻璃料糊组合物和电气元件的密封方法使用它
-
Application No.: US12271252Application Date: 2008-11-14
-
Publication No.: US07923393B2Publication Date: 2011-04-12
- Inventor: Jung-Hyun Son , Sang-Kyu Lee , Han-Bok Joo
- Applicant: Jung-Hyun Son , Sang-Kyu Lee , Han-Bok Joo
- Applicant Address: KR Gajwa-Dong, Seo-Gu, Incheon
- Assignee: DONGJIN SEMICHEM Co., Ltd.
- Current Assignee: DONGJIN SEMICHEM Co., Ltd.
- Current Assignee Address: KR Gajwa-Dong, Seo-Gu, Incheon
- Agency: Lexyoume IP Group, PLLC.
- Priority: KR10-2007-0120924 20071126
- Main IPC: C03C8/08
- IPC: C03C8/08 ; C03C8/14 ; C03C8/16 ; C03C8/24 ; C03C3/21 ; C03B23/00 ; B29C65/16 ; H01J9/26
Abstract:
The present invention relates to a low melting point frit paste composition and a sealing method for an electric element using the same, and more particularly, to a low melting point frit paste composition which is sealable and appropriate for a flat panel, protects an element weak to heat and improves a process yield with good print properties, and a sealing method for an electric element using the same.
Public/Granted literature
- US20090136766A1 Low melting point frit paste composition and sealing method for electric element using the same Public/Granted day:2009-05-28
Information query
