发明授权
US07923835B2 Package, electronic device, substrate having a separation region and a wiring layers, and method for manufacturing
有权
封装，电子器件，具有分离区域和布线层的衬底，以及制造方法
- 专利标题： Package, electronic device, substrate having a separation region and a wiring layers, and method for manufacturing
- 专利标题（中）： 封装，电子器件，具有分离区域和布线层的衬底，以及制造方法
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申请号： US12018263申请日： 2008-01-23
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公开(公告)号： US07923835B2公开(公告)日： 2011-04-12
- 发明人: Yoshihiro Kubota , Shirou Youda , Kazuto Tsuji
- 申请人： Yoshihiro Kubota , Shirou Youda , Kazuto Tsuji
- 申请人地址： JP Yokohama
- 专利权人： Fujitsu Semiconductor Limited
- 当前专利权人： Fujitsu Semiconductor Limited
- 当前专利权人地址： JP Yokohama
- 代理机构： Westerman, Hattori, Daniels & Adrian, LLP
- 优先权： JP2007-013159 20070123
- 主分类号： H01L23/04
- IPC分类号： H01L23/04 ; H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
An electronic device has a substrate that has first and second peripheral portions. The first peripheral portion provides a shearing position for separation. The electronic device has a plurality of wiring layers one of which forms a functional surface wiring on the substrate, an electronic element mounted on the substrate, and an encapsulation member formed over the substrate and the electronic element. The surface wiring is selectively disposed under the encapsulation member and in an area adjacent to the second peripheral portion.
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