发明授权
US07925072B2 Methods for identifying array areas in dies formed on a wafer and methods for setting up such methods
有权
用于识别在晶片上形成的模具中的阵列区域的方法和用于设置这种方法的方法
- 专利标题： Methods for identifying array areas in dies formed on a wafer and methods for setting up such methods
- 专利标题（中）： 用于识别在晶片上形成的模具中的阵列区域的方法和用于设置这种方法的方法
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申请号： US11683696申请日： 2007-03-08
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公开(公告)号： US07925072B2公开(公告)日： 2011-04-12
- 发明人: Chien-Huei (Adam) Chen , Ajay Gupta , Richard Wallingford , Kaustubh (Kaust) Namjoshi , Mike Van Riet , Michael Cook
- 申请人： Chien-Huei (Adam) Chen , Ajay Gupta , Richard Wallingford , Kaustubh (Kaust) Namjoshi , Mike Van Riet , Michael Cook
- 申请人地址： US CA Milpitas
- 专利权人： KLA-Tencor Technologies Corp.
- 当前专利权人： KLA-Tencor Technologies Corp.
- 当前专利权人地址： US CA Milpitas
- 代理商 Ann Marie Mewherter
- 主分类号： G06K9/00
- IPC分类号： G06K9/00
摘要：
Methods for identifying array areas in dies formed on a wafer and methods for setting up such methods are provided. One method for identifying array areas in dies formed on a wafer includes comparing an array pattern in a template image acquired in one of the array areas to a search area image acquired for the wafer. The method also includes determining areas in the search area image in which a pattern is formed that substantially matches the array pattern in the template image based on results of the comparing step. In addition, the method includes identifying the array areas in the dies formed on the wafer based on results of the determining step.
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