Invention Grant
US07925072B2 Methods for identifying array areas in dies formed on a wafer and methods for setting up such methods
有权
用于识别在晶片上形成的模具中的阵列区域的方法和用于设置这种方法的方法
- Patent Title: Methods for identifying array areas in dies formed on a wafer and methods for setting up such methods
- Patent Title (中): 用于识别在晶片上形成的模具中的阵列区域的方法和用于设置这种方法的方法
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Application No.: US11683696Application Date: 2007-03-08
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Publication No.: US07925072B2Publication Date: 2011-04-12
- Inventor: Chien-Huei (Adam) Chen , Ajay Gupta , Richard Wallingford , Kaustubh (Kaust) Namjoshi , Mike Van Riet , Michael Cook
- Applicant: Chien-Huei (Adam) Chen , Ajay Gupta , Richard Wallingford , Kaustubh (Kaust) Namjoshi , Mike Van Riet , Michael Cook
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Technologies Corp.
- Current Assignee: KLA-Tencor Technologies Corp.
- Current Assignee Address: US CA Milpitas
- Agent Ann Marie Mewherter
- Main IPC: G06K9/00
- IPC: G06K9/00
Abstract:
Methods for identifying array areas in dies formed on a wafer and methods for setting up such methods are provided. One method for identifying array areas in dies formed on a wafer includes comparing an array pattern in a template image acquired in one of the array areas to a search area image acquired for the wafer. The method also includes determining areas in the search area image in which a pattern is formed that substantially matches the array pattern in the template image based on results of the comparing step. In addition, the method includes identifying the array areas in the dies formed on the wafer based on results of the determining step.
Public/Granted literature
- US20080219545A1 METHODS FOR IDENTIFYING ARRAY AREAS IN DIES FORMED ON A WAFER AND METHODS FOR SETTING UP SUCH METHODS Public/Granted day:2008-09-11
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