Semiconductor device property extraction, generation, visualization, and monitoring methods
    1.
    发明授权
    Semiconductor device property extraction, generation, visualization, and monitoring methods 有权
    半导体器件属性提取,生成,可视化和监控方法

    公开(公告)号:US08611639B2

    公开(公告)日:2013-12-17

    申请号:US11830485

    申请日:2007-07-30

    CPC classification number: G01N21/9501

    Abstract: Various methods, carrier media, and systems for monitoring a characteristic of a specimen are provided. One computer-implemented method for monitoring a characteristic of a specimen includes determining a property of individual pixels on the specimen using output generated by inspecting the specimen with an inspection system. The method also includes determining a characteristic of individual regions on the specimen using the properties of the individual pixels in the individual regions. The method further includes monitoring the characteristic of the specimen based on the characteristics of the individual regions.

    Abstract translation: 提供了各种方法,载体介质和用于监测试样特征的系统。 一种用于监测样本特征的计算机实现方法包括使用通过用检查系统检查样本产生的输出来确定样本上的各个像素的特性。 该方法还包括使用各个区域中的各个像素的特性来确定样本上的各个区域的特征。 该方法还包括基于各个区域的特征来监测样本的特性。

    SYSTEMS AND METHODS FOR DETECTING DEFECTS ON A WAFER
    3.
    发明申请
    SYSTEMS AND METHODS FOR DETECTING DEFECTS ON A WAFER 有权
    用于检测波形缺陷的系统和方法

    公开(公告)号:US20100188657A1

    公开(公告)日:2010-07-29

    申请号:US12359476

    申请日:2009-01-26

    CPC classification number: G01N21/9501 G01N2021/887 H01L22/12

    Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.

    Abstract translation: 提供了用于检测晶片上的缺陷的系统和方法。 一种方法包括通过使用检查系统的第一和第二光学状态的检查系统扫描晶片来产生晶片的输出。 第一和第二光学状态由检查系统的至少一个光学参数的不同值来定义。 该方法还包括使用使用第二光学状态产生的输出使用第一光学状态产生的输出和晶片的第二图像数据为晶片产生第一图像数据。 此外,该方法包括将第一图像数据和对应于晶片上基本相同位置的第二图像数据组合,从而产生用于晶片的附加图像数据。 该方法还包括使用附加图像数据检测晶片上的缺陷。

    SEMICONDUCTOR DEVICE PROPERTY EXTRACTION, GENERATION, VISUALIZATION, AND MONITORING METHODS
    4.
    发明申请
    SEMICONDUCTOR DEVICE PROPERTY EXTRACTION, GENERATION, VISUALIZATION, AND MONITORING METHODS 有权
    半导体器件属性提取,生成,可视化和监控方法

    公开(公告)号:US20090037134A1

    公开(公告)日:2009-02-05

    申请号:US11830485

    申请日:2007-07-30

    CPC classification number: G01N21/9501

    Abstract: Various methods, carrier media, and systems for monitoring a characteristic of a specimen are provided. One computer-implemented method for monitoring a characteristic of a specimen includes determining a property of individual pixels on the specimen using output generated by inspecting the specimen with an inspection system. The method also includes determining a characteristic of individual regions on the specimen using the properties of the individual pixels in the individual regions. The method further includes monitoring the characteristic of the specimen based on the characteristics of the individual regions.

    Abstract translation: 提供了各种方法,载体介质和用于监测试样特征的系统。 一种用于监测样本特征的计算机实现方法包括使用通过用检查系统检查样本产生的输出来确定样本上的各个像素的特性。 该方法还包括使用各个区域中的各个像素的特性来确定样本上的各个区域的特征。 该方法还包括基于各个区域的特征来监测样本的特性。

    Status Polling
    5.
    发明申请
    Status Polling 有权
    状态轮询

    公开(公告)号:US20070124095A1

    公开(公告)日:2007-05-31

    申请号:US11622720

    申请日:2007-01-12

    CPC classification number: G05B19/41855 G05B2219/37224

    Abstract: An inspection system for detecting anomalies on a substrate. The inspection system has a sensor array for generating image data. A first high speed network is coupled to the sensor array and receives and communicates the image data. An array of process nodes is coupled to the first high speed network, and receives and processes the image data to produce anomaly reports. Each process node has an interface card coupled to the first high speed network, that receives the image data from the first high speed network and formats the image data according to a high speed interface bus protocol. The interface card sets a register indicating whether a predetermined amount of image data has been stored in a memory, and the process node reads the register to determine whether the predetermined amount of image data has been stored in the memory, and initiates image processing when the register indicates that the predetermined amount of image data has been stored in the memory.

    Abstract translation: 用于检测基板上的异常的检查系统。 检查系统具有用于生成图像数据的传感器阵列。 第一高速网络耦合到传感器阵列并接收并传送图像数据。 一系列过程节点耦合到第一高速网络,并接收和处理图像数据以产生异常报告。 每个处理节点具有耦合到第一高速网络的接口卡,其接收来自第一高速网络的图像数据,并且根据高速接口总线协议格式化图像数据。 接口卡设置表示预定量的图像数据是否已经存储在存储器中的寄存器,并且处理节点读取寄存器以确定预定量的图像数据是否已被存储在存储器中,并且当 寄存器指示预定量的图像数据已被存储在存储器中。

    Computer-implemented methods, carrier media, and systems for determining sizes of defects detected on a wafer
    7.
    发明授权
    Computer-implemented methods, carrier media, and systems for determining sizes of defects detected on a wafer 有权
    计算机实现的方法,载体介质和用于确定在晶片上检测到的缺陷尺寸的系统

    公开(公告)号:US08000905B1

    公开(公告)日:2011-08-16

    申请号:US11855589

    申请日:2007-09-14

    CPC classification number: G01N21/8851 G01N21/9501 G01N21/956 G01N2021/8854

    Abstract: Computer-implemented methods, carrier media, and systems for determining sizes of defects detected on a wafer are provided. One computer-implemented method includes separating the defects into groups based on output acquired for the defects by multiple channels of an inspection system used to detect the defects on the wafer. The method also includes separating the defects in one or more of the groups into subgroups based on the output acquired for the defects by one or more of the multiple channels. In addition, the method includes determining the sizes of one or more of the defects in one or more of the subgroups separately based on the output acquired for the defects by only one of the multiple channels and a calibration parameter. The calibration parameter is different for each of the subgroups and is acquired by using another system to measure actual sizes of defects detected on other wafers.

    Abstract translation: 提供了计算机实现的方法,载体介质和用于确定晶片上检测到的缺陷尺寸的系统。 一种计算机实现的方法包括基于用于检测晶片上的缺陷的检查系统的多个通道为缺陷获取的输出将缺陷分离成组。 该方法还包括基于通过一个或多个多个通道为缺陷获得的输出将一个或多个组中的缺陷分离成子组。 此外,该方法包括基于仅通过多个通道中的一个获得的用于缺陷的输出和校准参数,分别确定一个或多个子组中的一个或多个子组中的一个或多个缺陷的大小。 校准参数对于每个子组是不同的,并且通过使用另一个系统来测量在其他晶片上检测到的缺陷的实际尺寸来获取。

    Methods for identifying array areas in dies formed on a wafer and methods for setting up such methods
    8.
    发明授权
    Methods for identifying array areas in dies formed on a wafer and methods for setting up such methods 有权
    用于识别在晶片上形成的模具中的阵列区域的方法和用于设置这种方法的方法

    公开(公告)号:US07925072B2

    公开(公告)日:2011-04-12

    申请号:US11683696

    申请日:2007-03-08

    CPC classification number: G06T7/001 G06T2207/30148

    Abstract: Methods for identifying array areas in dies formed on a wafer and methods for setting up such methods are provided. One method for identifying array areas in dies formed on a wafer includes comparing an array pattern in a template image acquired in one of the array areas to a search area image acquired for the wafer. The method also includes determining areas in the search area image in which a pattern is formed that substantially matches the array pattern in the template image based on results of the comparing step. In addition, the method includes identifying the array areas in the dies formed on the wafer based on results of the determining step.

    Abstract translation: 提供了用于识别在晶片上形成的模具中的阵列区域的方法以及用于设置这种方法的方法。 用于识别在晶片上形成的管芯中的阵列区域的一种方法包括将在一个阵列区域中获取的模板图像中的阵列图案与为晶片获取的搜索区域图像进行比较。 该方法还包括基于比较步骤的结果来确定在其中形成图案的搜索区域图像中的与模板图像中的阵列图案基本一致的区域。 此外,该方法包括基于确定步骤的结果识别在晶片上形成的管芯中的阵列区域。

    COMPUTER-IMPLEMENTED METHODS, CARRIER MEDIA, AND SYSTEMS FOR SELECTING POLARIZATION SETTINGS FOR AN INSPECTION SYSTEM
    10.
    发明申请
    COMPUTER-IMPLEMENTED METHODS, CARRIER MEDIA, AND SYSTEMS FOR SELECTING POLARIZATION SETTINGS FOR AN INSPECTION SYSTEM 有权
    计算机实现方法,载体介质和选择用于检查系统的极化设置的系统

    公开(公告)号:US20090284733A1

    公开(公告)日:2009-11-19

    申请号:US12120577

    申请日:2008-05-14

    CPC classification number: G01N21/21 G01N21/9501 G01N2021/8822 G01N2021/8867

    Abstract: Computer-implemented methods, carrier media, and systems for selecting polarization settings for an inspection system for inspection of a layer of a wafer are provided. One method includes detecting a population of defects on the layer of the wafer using results of each of two or more scans of the wafer performed with different combinations of polarization settings of the inspection system for illumination and collection of light scattered from the wafer. The method also includes identifying a subpopulation of the defects for each of the different combinations, each of which includes the defects that are common to at least two of the different combinations, and determining a characteristic of a measure of signal-to-noise for each of the subpopulations. The method further includes selecting the polarization settings for the illumination and the collection to be used for the inspection corresponding to the subpopulation having the best value for the characteristic.

    Abstract translation: 提供了计算机实现的方法,载体介质和用于选择用于检查晶片层的检查系统的偏振设置的系统。 一种方法包括使用用于照明的偏光设置的不同组合和从晶片散射的光的收集的晶片的两次或多次扫描中的每一个的结果来检测晶片层上的缺陷群。 该方法还包括识别每个不同组合的缺陷的子群体,每个组合包括对于至少两个不同组合是共同的缺陷,以及确定每个组合的信噪比度量的特性 的亚群。 该方法还包括选择用于与用于该特征具有最佳值的亚群相对应的检查的照明和收集的偏振设置。

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