发明授权
- 专利标题： Method of polishing a target surface
- 专利标题（中）： 抛光目标表面的方法
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申请号： US12126383申请日： 2008-05-23
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公开(公告)号： US07927187B2公开(公告)日： 2011-04-19
- 发明人: Jun Watanabe , Tetsujiro Tada , Takashi Arahata , Jun Tamura , Moriaki Akazawa , Masaru Sakamoto , Takahiko Kawasaki
- 申请人： Jun Watanabe , Tetsujiro Tada , Takashi Arahata , Jun Tamura , Moriaki Akazawa , Masaru Sakamoto , Takahiko Kawasaki
- 申请人地址： JP Tokyo
- 专利权人： NIHON Micro Coating Co., Ltd.
- 当前专利权人： NIHON Micro Coating Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Weaver Austin Villeneuve & Sampson LLP
- 优先权： JP2007-138613 20070525
- 主分类号： B24B7/22
- IPC分类号： B24B7/22
摘要：
A circular polishing pad has grooves formed on the surface in a spiral pattern with its center point offset from the center of the pad. The spiral pattern is an Archimedean spiral pattern or a parabolic spiral pattern. A target object is polished by using such a polishing pad without oscillating the platen to which the polishing pad is pasted or the polishing head that holds the target object.
公开/授权文献
- US20080293332A1 POLISHING PAD AND METHOD OF POLISHING 公开/授权日：2008-11-27
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