Invention Grant
- Patent Title: Laminated core and method for manufacturing the same
- Patent Title (中): 层压芯及其制造方法
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Application No.: US12830820Application Date: 2010-07-06
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Publication No.: US07928627B2Publication Date: 2011-04-19
- Inventor: Akira Nagai , Iwao Myojin , Akinori Hoshino , Masafumi Sakuma , Hiroyuki Yamamoto , Haruji Suzuki
- Applicant: Akira Nagai , Iwao Myojin , Akinori Hoshino , Masafumi Sakuma , Hiroyuki Yamamoto , Haruji Suzuki
- Applicant Address: JP Kitakyushu-shi
- Assignee: Mitsui High-Tec, Inc.
- Current Assignee: Mitsui High-Tec, Inc.
- Current Assignee Address: JP Kitakyushu-shi
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Main IPC: H02K1/18
- IPC: H02K1/18 ; H02K1/14

Abstract:
A laminated core (10) and a method for manufacturing the same formed with multiple continuous segment core pieces (13) wound in a spiral form by bending connecting portions (12) mutually connecting the segment core pieces (13), the connecting portions (12) being formed in an outer peripheral area (11), while the connecting portions (12) of vertically adjacent layers being displaced in a circumferential direction with inner edges or outer edges of the segment core pieces (13) fitted, the laminated core comprising: a concave cutout (21) provided in a radial exterior of each connecting portion (12) to dispose a radially expanded portion (20) within an outer circle of the laminated core (10), the radially expanded portion (20) being formed with each connecting portion (12) expanding radially outward at the time of bending each connecting portion (12); an interior cutout (22) provided in a radial interior of each connecting portion (12) to define a bending position of each connecting portion (12); and a receptacle (16) provided in a radial exterior of each segment core piece (13) to receive an expanded part (15) formed in the thickness direction at the time of bending each connecting portion (12).
Public/Granted literature
- US20100270888A1 LAMINATED CORE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2010-10-28
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